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BRJP20190624001

A Japanese high-tech equipment distributor is seeking disruptive technology suppliers in the EU

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ABSTRACT

A Japanese company specialised in high-end equipment, including semiconductor, heavy and automotive industries, is looking for EU suppliers of disruptive manufacturing equipment: automated electrolytic polishing system, laser processing tool and imaging ellipsometry.

The Japanese company would directly purchase patented leading edge technology and would expect exclusive distribution rights for the Japanese market. The partnership would be concluded under a distribution services agreement.


FULL DESCRIPTION

A Japanese high-tech capital equipment distributor is seeking equipment suppliers of disruptive manufacturing equipment to diversify its business.

Specifically the company is looking for: automated electrolytic polishing system, laser processing tool and imaging ellipsometry technology.

The market segment covered today is semiconductor, heavy industry, automotive industry and machine tool manufacturing industry.They expect leading edge technology, which should be protected by intellectual property right or know-how. The effectiveness of the equipment should have been proved by feasibility studies and it should be ready for the market, ideally Technology Readiness Level (TRL) 8 or 9.

After a successful evaluation of the product, the Japanese company would directly buy from the EU manufacturer and re-sell the equipment to their customer base in Japan.

The EU company would benefit from the company’s strong sales force including top-to-top relationship with most of the prominent Japanese companies. The Japanese company’s engineering resources, consisting of more than 100 engineers, would provide the highest level of local support and service during and after the sales.

The Japanese company is listed in the first section of Tokyo Stock Exchange and has been distributing foreign capital equipment to Japanese manufacturing sector for decades.

The company is seeking exclusive distribution rights for the Japanese market under a distribution services agreement.


Partner expertise sought:

- Type of partner sought: The company is looking for disruptive technology backed by patent or trade secret or know-how to distribute in Japan.

1. Automated electrolytic polishing system.
The system will be sold as post process tool of metal 3D printer, together with metal 3D printer. The metal type to be polished is steel, stainless steel, titanium, aluminium, nickel, chrome cobalt alloy etc. Target roughness after polish is Ra < 0.15 micron. Support weight is 100 kg or higher. Dry electrolytic process is preferable.

2. Laser processing tool for automotive and aerospace industry.
Femtosecond laser tool with capability for automated processing to be used for emerging material such as compound semiconductors, composite materials and other difficult to handle material.

3. Imaging ellipsometry.
Angle resolution < 1um, 3D mapping of thickness distribution, analysis and measurement of film on micro structure or on patterned substrate.
- Specific area of activity of the partner: Only truly disruptive technology with a unique selling point in the Japanese market will be considered. Necessary steps to protect intellectual property by Japanese patents should be taken by the European product manufacturer.

The European product manufacturer is supposed to provide sampling or demonstration to support the sales of the Japanese company.

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KEY INFORMATION

Country of origin
JAPAN
Profile date
04/07/2019
Deadline
04/07/2020

PARTNERSHIP(S) SOUGHT

Distribution services agreement

CLASSIFICATIONS

INDUSTRY SECTORS
Retail & Wholesale
TECHNOLOGY KEYWORDS
none...
COMMERCIAL KEYWORDS
Wholesale of machine tools
MARKET KEYWORDS
INDUSTRIAL PRODUCTS / Industrial Automation / Other industrial automation / INDUSTRIAL PRODUCTS / Industrial Equipment and Machinery / Other industrial equipment and machinery

FIND OUT MORE

Contact Enterprise Europe Network Scotland by email at info@enterprise-europe-scotland.com, quoting reference number BRJP20190624001